Semiconductor Weekly | 20230829

1. Nvidia released its second quarter financial report (as of July 30, 2023), showing that during the period, it achieved revenue of US$13.51 billion, a year-on-year increase of 101%, and a month-on-month increase of 88%; net profit was US$6.19 billion, a year-on-year increase of 843%. The Q2 revenue of the data center business was US$10.32 billion, a record high, with a year-on-year increase of 171% and a quarter-on-quarter increase of 141%.


2. The Financial Associated Press reported on August 24 that Intel is actively expanding its foundry business, and its advanced process technology progress continues to attract attention. The company said that it is estimated that potential external customers will be more inclined to choose Intel 3 and Intel 18A processes in the future. Since the Intel 3 process development progress will be ready in the second half of this year, the outside world believes that this may mean that in the next short term, Intel will focus on this process in the field of advanced process wafer foundry to deal with the competition with TSMC, Competition from industry players such as Samsung


3. Korea Economic Daily reported on August 24 that industry sources revealed that Samsung Electronics is preparing to provide AMD with high-bandwidth memory (HBM) chips and one-stop packaging services. According to the report, Samsung's fourth-generation HBM chip "HBM3" and packaging services recently passed AMD's quality tests, and AMD plans to use these chips and services for its Instinct MI300X accelerator. Instinct MI300X combines CPU, GPU and HBM3 and is expected to be released in the fourth quarter of this year.


4. Sci-Tech Innovation Board Daily, August 29. On Monday local time, Intel said at a semiconductor technology conference that it will launch a new data center chip, Sierra Forest, next year. The chip will do 240 percent more computing work per watt than current data center chips, the first time Intel has disclosed such figures.


5. Taiwan's Electronic Times reported on August 29 that Intel's Arrow Lake, which will be launched in the second half of 2024, has currently reported that the production blueprint has been revised, and it is tentatively scheduled to have two versions in parallel. In addition to U series and other CPUs that will skip the Intel 20A process and change to Intel 3, the top H/HX series CPUs will use TSMC’s N3 process for OEM, superimposing graphics chips, system chips, and I/O chips that were originally delivered to TSMC. Maybe the entire processor is produced at TSMC.